BYCHIPS is the stocking distributor for ELXV350EC3270MEB5D, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ELXV350EC3270MEB5D by email, we will give you a best price according your plan.
Buy ELXV350EC3270MEB5D with BYCHPS
Buy with guarantee
ELXV350EC3270MEB5D
- Part Number:
- ELXV350EC3270MEB5D
- Manufacturer:
- Nippon Chemi-Con
- Description:
- CAP ALUM 27UF 20% 35V RADIAL
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15113 Pieces
- Data sheet:
- ELXV350EC3270MEB5D.pdf
Introduction
Specifications
| Voltage Rating: | 35V |
|---|---|
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | 0.197" Dia (5.00mm) |
| Series: | LXV |
| Ripple Current: | 66mA @ 120Hz |
| Polarization: | Polar |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Operating Temperature: | -55°C ~ 105°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | ELXV350EC3270MEB5D |
| Lifetime @ Temp.: | 2000 Hrs @ 105°C |
| Lead Spacing: | 1.240" (31.50mm) |
| Impedance: | 720 mOhm |
| Height - Seated (Max): | 0.512" (13.00mm) |
| Expanded Description: | 27µF 35V Aluminum Capacitors Radial, Can 2000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | - |
| Description: | CAP ALUM 27UF 20% 35V RADIAL |
| Capacitance: | 27µF |
| Applications: | Automotive |
| Email: | [email protected] |
Related parts for ELXV350EC3270MEB5D
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog