BYCHIPS is the stocking distributor for EKMM3J1VSN741MA50W, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EKMM3J1VSN741MA50W by email, we will give you a best price according your plan.
Buy EKMM3J1VSN741MA50W with BYCHPS
Buy with guarantee
EKMM3J1VSN741MA50W
- Part Number:
- EKMM3J1VSN741MA50W
- Manufacturer:
- Nippon Chemi-Con
- Description:
- CAP ALUM 740UF 20% SNAP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15507 Pieces
- Data sheet:
- EKMM3J1VSN741MA50W.pdf
Introduction
Specifications
| Voltage Rating: | - |
|---|---|
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | 1.378" Dia (35.00mm) |
| Series: | KMM |
| Ripple Current: | - |
| Polarization: | Polar |
| Packaging: | Bulk |
| Package / Case: | Radial, Can - Snap-In |
| Operating Temperature: | -25°C ~ 105°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | EKMM3J1VSN741MA50W |
| Lifetime @ Temp.: | - |
| Lead Spacing: | 0.394" (10.00mm) |
| Impedance: | - |
| Height - Seated (Max): | 2.047" (52.00mm) |
| Expanded Description: | 740µF Aluminum Capacitors Radial, Can - Snap-In |
| ESR (Equivalent Series Resistance): | - |
| Description: | CAP ALUM 740UF 20% SNAP |
| Capacitance: | 740µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for EKMM3J1VSN741MA50W
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog