BYCHIPS is the stocking distributor for EGPA350ELL272ML35S, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EGPA350ELL272ML35S by email, we will give you a best price according your plan.
Buy EGPA350ELL272ML35S with BYCHPS
Buy with guarantee
EGPA350ELL272ML35S
- Part Number:
- EGPA350ELL272ML35S
- Manufacturer:
- Nippon Chemi-Con
- Description:
- CAP ALUM 2700UF 20% 35V RADIAL
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14492 Pieces
- Data sheet:
- EGPA350ELL272ML35S.pdf
Introduction
Specifications
| Voltage Rating: | 35V |
|---|---|
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | 0.630" Dia (16.00mm) |
| Series: | GPA |
| Ripple Current: | 2.6925A @ 120Hz |
| Polarization: | Polar |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Other Names: | 565-3393 EGPA350ELL272ML35S-ND |
| Operating Temperature: | -40°C ~ 125°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | EGPA350ELL272ML35S |
| Lifetime @ Temp.: | 5000 Hrs @ 125°C |
| Impedance: | - |
| Height - Seated (Max): | 1.437" (36.50mm) |
| Expanded Description: | 2700µF 35V Aluminum Capacitors Radial, Can 20 mOhm @ 100kHz 5000 Hrs @ 125°C |
| ESR (Equivalent Series Resistance): | 20 mOhm @ 100kHz |
| Description: | CAP ALUM 2700UF 20% 35V RADIAL |
| Capacitance: | 2700µF |
| Applications: | Automotive |
| Email: | [email protected] |
Related parts for EGPA350ELL272ML35S
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers