BYCHIPS is the stocking distributor for EEH-ZA1V270P, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EEH-ZA1V270P by email, we will give you a best price according your plan.
Buy EEH-ZA1V270P with BYCHPS
Buy with guarantee
EEH-ZA1V270P
- Part Number:
- EEH-ZA1V270P
- Manufacturer:
- Panasonic
- Description:
- CAP ALUM POLY HYB 27UF 35V SMD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12185 Pieces
Introduction
Specifications
| Voltage Rating: | 35V |
|---|---|
| Type: | Hybrid |
| Tolerance: | ±20% |
| Surface Mount Land Size: | 0.260" L x 0.260" W (6.60mm x 6.60mm) |
| Size / Dimension: | 0.248" Dia (6.30mm) |
| Series: | ZA |
| Ripple Current - Low Frequency: | 130mA @ 100Hz |
| Ripple Current - High Frequency: | 1.3A @ 100kHz |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | Radial, Can - SMD |
| Other Names: | EEHZA1V270P P15452TR |
| Operating Temperature: | -55°C ~ 105°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | EEH-ZA1V270P |
| Lifetime @ Temp.: | 10000 Hrs @ 105°C |
| Lead Spacing: | - |
| Impedance: | - |
| Height - Seated (Max): | 0.240" (6.10mm) |
| Expanded Description: | 27µF ±20% 35V Aluminum Polymer Capacitor Radial, Can - SMD 60 mOhm 10000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | 60 mOhm |
| Description: | CAP ALUM POLY HYB 27UF 35V SMD |
| Capacitance: | 27µF |
| Applications: | - |
| Email: | [email protected] |
Related parts for EEH-ZA1V270P
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers