BYCHIPS is the stocking distributor for EEF-SR0E181R4, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EEF-SR0E181R4 by email, we will give you a best price according your plan.
Buy EEF-SR0E181R4 with BYCHPS
Buy with guarantee
EEF-SR0E181R4
- Part Number:
- EEF-SR0E181R4
- Manufacturer:
- Panasonic
- Description:
- CAP ALUM POLY 180UF 20% 2.5V SMD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15656 Pieces
Introduction
Specifications
| Voltage Rating: | 2.5V |
|---|---|
| Type: | Polymer |
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | 0.287" L x 0.169" W (7.30mm x 4.30mm) |
| Series: | SP-Cap, SR |
| Ripple Current - Low Frequency: | - |
| Ripple Current - High Frequency: | 8.5A @ 100kHz |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 2917 (7343 Metric) |
| Other Names: | EEFSR0E181R4 |
| Operating Temperature: | -55°C ~ 105°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | EEF-SR0E181R4 |
| Lifetime @ Temp.: | 2000 Hrs @ 105°C |
| Lead Spacing: | - |
| Impedance: | - |
| Height - Seated (Max): | 0.039" (1.00mm) |
| Expanded Description: | 180µF ±20% 2.5V Aluminum Polymer Capacitor 2917 (7343 Metric) 4.5 mOhm 2000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | 4.5 mOhm |
| Description: | CAP ALUM POLY 180UF 20% 2.5V SMD |
| Capacitance: | 180µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for EEF-SR0E181R4
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers