BYCHIPS is the stocking distributor for EEE-TKV681UAM, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EEE-TKV681UAM by email, we will give you a best price according your plan.
Buy EEE-TKV681UAM with BYCHPS
Buy with guarantee
EEE-TKV681UAM
- Part Number:
- EEE-TKV681UAM
- Manufacturer:
- Panasonic
- Description:
- CAP ALUM 680UF 20% 35V SMD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19873 Pieces
- Data sheet:
- 1.EEE-TKV681UAM.pdf2.EEE-TKV681UAM.pdf
Introduction
Specifications
| Voltage Rating: | 35V |
|---|---|
| Tolerance: | ±20% |
| Surface Mount Land Size: | 0.669" L x 0.669" W (17.00mm x 17.00mm) |
| Size / Dimension: | 0.630" Dia (16.00mm) |
| Series: | TK |
| Ripple Current: | 825mA @ 120Hz |
| Polarization: | Polar |
| Packaging: | Original-Reel® |
| Package / Case: | Radial, Can - SMD |
| Other Names: | PCE4895DKR |
| Operating Temperature: | -40°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | EEE-TKV681UAM |
| Lifetime @ Temp.: | 2000 Hrs @ 125°C |
| Lead Spacing: | - |
| Impedance: | - |
| Height - Seated (Max): | 0.650" (16.50mm) |
| Expanded Description: | 680µF 35V Aluminum Capacitors Radial, Can - SMD 80 mOhm @ 100kHz 2000 Hrs @ 125°C |
| ESR (Equivalent Series Resistance): | 80 mOhm @ 100kHz |
| Description: | CAP ALUM 680UF 20% 35V SMD |
| Capacitance: | 680µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for EEE-TKV681UAM
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers