BYCHIPS is the stocking distributor for EDLRG105V3R6C, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EDLRG105V3R6C by email, we will give you a best price according your plan.
Buy EDLRG105V3R6C with BYCHPS
Buy with guarantee
EDLRG105V3R6C
- Part Number:
- EDLRG105V3R6C
- Manufacturer:
- Cornell Dubilier Electronics
- Description:
- CAP 1F -20% +80% 3.6V T/H
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15474 Pieces
- Data sheet:
- EDLRG105V3R6C.pdf
Introduction
Specifications
| Voltage - Rated: | 3.6V |
|---|---|
| Tolerance: | -20%, +80% |
| Termination: | Through Hole |
| Size / Dimension: | 0.748" Dia (19.00mm) |
| Series: | RG |
| Packaging: | Bulk |
| Package / Case: | Radial, Can, Vertical |
| Other Names: | 338-3474 |
| Operating Temperature: | -25°C ~ 85°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 14 Weeks |
| Manufacturer Part Number: | EDLRG105V3R6C |
| Lifetime @ Temp.: | 2000 Hrs @ 85°C |
| Lead Spacing: | 0.197" (5.00mm) |
| Height - Seated (Max): | 0.827" (21.00mm) |
| Expanded Description: | 1F -20%, +80%(EDLC) Supercapacitor 3.6V Radial, Can, Vertical 20 Ohm @ 1kHz 2000 Hrs @ 85°C |
| ESR (Equivalent Series Resistance): | 20 Ohm @ 1kHz |
| Description: | CAP 1F -20% +80% 3.6V T/H |
| Capacitance: | 1F |
| Email: | [email protected] |
Related parts for EDLRG105V3R6C
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
DX-5R5V224U | Elna America | CAP 220MF -20% +80% 5.5V T/H | Inquiry |
 |
EDLRG105H3R6C | Cornell Dubilier Electronics (CDE) | CAP 1F -20% +80% 3.6V T/H | Inquiry |
 |
EEC-RF0V684 | Panasonic Electronic Components | CAP 680MF -20% +80% 3.6V T/H | Inquiry |
 |
SCCT30B156SRB | AVX Corporation | CAPACITOR 15F 2.7V THRU HOLE | Inquiry |
 |
DZ-2R5D106T | Elna America | CAP 10F -20% +80% 2.5V T/H | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers