BYCHIPS is the stocking distributor for EDLF684B5R5C, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EDLF684B5R5C by email, we will give you a best price according your plan.
Buy EDLF684B5R5C with BYCHPS
Buy with guarantee
EDLF684B5R5C
- Part Number:
- EDLF684B5R5C
- Manufacturer:
- Cornell Dubilier Electronics
- Description:
- CAP 680MF 5.5V THROUGH HOLE
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14081 Pieces
- Data sheet:
- EDLF684B5R5C.pdf
Introduction
Specifications
| Voltage - Rated: | 5.5V |
|---|---|
| Tolerance: | - |
| Termination: | Through Hole |
| Size / Dimension: | 0.846" Dia (21.50mm) |
| Series: | F |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Operating Temperature: | -25°C ~ 85°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 14 Weeks |
| Manufacturer Part Number: | EDLF684B5R5C |
| Lifetime @ Temp.: | 1000 Hrs @ 85°C |
| Lead Spacing: | 0.197" (5.00mm) |
| Height - Seated (Max): | 0.374" (9.50mm) |
| Expanded Description: | 680mF (EDLC) Supercapacitor 5.5V Radial, Can 50 Ohm @ 1kHz 1000 Hrs @ 85°C |
| ESR (Equivalent Series Resistance): | 50 Ohm @ 1kHz |
| Description: | CAP 680MF 5.5V THROUGH HOLE |
| Capacitance: | 680mF |
| Email: | [email protected] |
Related parts for EDLF684B5R5C
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
EEC-S5R5V474 | Panasonic Electronic Components | CAP 470MF -20% +150% 5.5V T/H | Inquiry |
 |
2.5DMB3R3M8X20 | Rubycon | CAP 3.3F 20% 2.5V THROUGH HOLE | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers