BYCHIPS is the stocking distributor for ECW-U1H224JC9, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ECW-U1H224JC9 by email, we will give you a best price according your plan.
Buy ECW-U1H224JC9 with BYCHPS
Buy with guarantee
ECW-U1H224JC9
- Part Number:
- ECW-U1H224JC9
- Manufacturer:
- Panasonic
- Description:
- CAP FILM 0.22UF 5% 50VDC 2416
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15137 Pieces
- Data sheet:
- ECW-U1H224JC9.pdf
Introduction
Specifications
| Voltage Rating - DC: | 50V |
|---|---|
| Voltage Rating - AC: | - |
| Tolerance: | ±5% |
| Termination: | Solder Pads |
| Size / Dimension: | 0.236" L x 0.161" W (6.00mm x 4.10mm) |
| Series: | ECW-U(C) |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 2416 (6041 Metric) |
| Other Names: | ECWU1H224JC9 PCF1152TR |
| Operating Temperature: | -55°C ~ 105°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | ECW-U1H224JC9 |
| Lead Spacing: | - |
| Height - Seated (Max): | 0.118" (3.00mm) |
| Features: | - |
| Expanded Description: | 0.22µF ±5% Film Capacitor 50V Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked 2416 (6041 Metric) |
| ESR (Equivalent Series Resistance): | - |
| Dielectric Material: | Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked |
| Description: | CAP FILM 0.22UF 5% 50VDC 2416 |
| Capacitance: | 0.22µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for ECW-U1H224JC9
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers