BYCHIPS is the stocking distributor for ECH-U1C473JB5, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ECH-U1C473JB5 by email, we will give you a best price according your plan.
Buy ECH-U1C473JB5 with BYCHPS
Buy with guarantee
ECH-U1C473JB5
- Part Number:
- ECH-U1C473JB5
- Manufacturer:
- Panasonic
- Description:
- CAP FILM 0.047UF 5% 16VDC 1206
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12930 Pieces
- Data sheet:
- ECH-U1C473JB5.pdf
Introduction
Specifications
| Voltage Rating - DC: | 16V |
|---|---|
| Voltage Rating - AC: | - |
| Tolerance: | ±5% |
| Termination: | Solder Pads |
| Size / Dimension: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| Series: | ECH-U(B) |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1206 (3216 Metric) |
| Other Names: | ECHU1C473JB5 PCF1084TR |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | ECH-U1C473JB5 |
| Lead Spacing: | - |
| Height - Seated (Max): | 0.063" (1.60mm) |
| Features: | - |
| Expanded Description: | 0.047µF ±5% Film Capacitor 16V Polyphenylene Sulfide (PPS), Metallized - Stacked 1206 (3216 Metric) |
| ESR (Equivalent Series Resistance): | - |
| Dielectric Material: | Polyphenylene Sulfide (PPS), Metallized - Stacked |
| Description: | CAP FILM 0.047UF 5% 16VDC 1206 |
| Capacitance: | 0.047µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for ECH-U1C473JB5
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers