BYCHIPS is the stocking distributor for ECE-B1JV331S, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ECE-B1JV331S by email, we will give you a best price according your plan.
Buy ECE-B1JV331S with BYCHPS
Buy with guarantee
ECE-B1JV331S
- Part Number:
- ECE-B1JV331S
- Manufacturer:
- Panasonic
- Description:
- CAP ALUM 330UF 20% 63V AXIAL
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 19227 Pieces
- Data sheet:
- ECE-B1JV331S.pdf
Introduction
Specifications
| Voltage Rating: | 63V |
|---|---|
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | - |
| Series: | SU |
| Ripple Current: | 450mA @ 120Hz |
| Polarization: | Polar |
| Packaging: | Bulk |
| Package / Case: | Axial, Can |
| Other Names: | 330/63A ECEB1JV331S P5095 |
| Operating Temperature: | -40°C ~ 85°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | ECE-B1JV331S |
| Lifetime @ Temp.: | - |
| Lead Spacing: | - |
| Impedance: | - |
| Height - Seated (Max): | - |
| Expanded Description: | 330µF 63V Aluminum Capacitors Axial, Can |
| ESR (Equivalent Series Resistance): | - |
| Description: | CAP ALUM 330UF 20% 63V AXIAL |
| Capacitance: | 330µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for ECE-B1JV331S
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers