BYCHIPS is the stocking distributor for DZN-2R7D335Z6T, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DZN-2R7D335Z6T by email, we will give you a best price according your plan.
Buy DZN-2R7D335Z6T with BYCHPS
Buy with guarantee
DZN-2R7D335Z6T
- Part Number:
- DZN-2R7D335Z6T
- Manufacturer:
- Elna America
- Description:
- CAP 3.3F -20% +80% 2.7V T/H
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12493 Pieces
- Data sheet:
- DZN-2R7D335Z6T.pdf
Introduction
Specifications
| Voltage - Rated: | 2.7V |
|---|---|
| Tolerance: | -20%, +80% |
| Termination: | Through Hole |
| Size / Dimension: | 0.492" Dia (12.50mm) |
| Series: | DZN |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Operating Temperature: | -25°C ~ 70°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 18 Weeks |
| Manufacturer Part Number: | DZN-2R7D335Z6T |
| Lifetime @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | 0.197" (5.00mm) |
| Height - Seated (Max): | 0.984" (25.00mm) |
| Expanded Description: | 3.3F -20%, +80%(EDLC) Supercapacitor 2.7V Radial, Can 200 mOhm @ 1kHz 1000 Hrs @ 70°C |
| ESR (Equivalent Series Resistance): | 200 mOhm @ 1kHz |
| Description: | CAP 3.3F -20% +80% 2.7V T/H |
| Capacitance: | 3.3F |
| Email: | [email protected] |
Related parts for DZN-2R7D335Z6T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers