BYCHIPS is the stocking distributor for DSPIC33FJ09GS302T-I/TL, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DSPIC33FJ09GS302T-I/TL by email, we will give you a best price according your plan.
Buy DSPIC33FJ09GS302T-I/TL with BYCHPS
Buy with guarantee
DSPIC33FJ09GS302T-I/TL
- Part Number:
- DSPIC33FJ09GS302T-I/TL
- Manufacturer:
- Micrel / Microchip Technology
- Description:
- IC MCU 16BIT 9KB FLASH 36VTLA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15082 Pieces
Introduction
Specifications
| Voltage - Supply (Vcc/Vdd): | 3 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 36-VTLA (5x5) |
| Speed: | 40 MIPs |
| Series: | dsPIC™ 33F |
| RAM Size: | 1K x 8 |
| Program Memory Type: | FLASH |
| Program Memory Size: | 9KB (3K x 24) |
| Peripherals: | Brown-out Detect/Reset, POR, PWM, WDT |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 36-VFTLA Exposed Pad |
| Oscillator Type: | Internal |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Number of I/O: | 21 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | DSPIC33FJ09GS302T-I/TL |
| Expanded Description: | dsPIC dsPIC™ 33F Microcontroller IC 16-Bit 40 MIPs 9KB (3K x 24) FLASH 36-VTLA (5x5) |
| EEPROM Size: | - |
| Description: | IC MCU 16BIT 9KB FLASH 36VTLA |
| Data Converters: | A/D 8x10b, D/A 2x10b |
| Core Size: | 16-Bit |
| Core Processor: | dsPIC |
| Connectivity: | I²C, IrDA, LIN, SPI, UART/USART |
| Email: | [email protected] |
Related parts for DSPIC33FJ09GS302T-I/TL
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers