BYCHIPS is the stocking distributor for DSPIC33EV64GM106-E/MR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DSPIC33EV64GM106-E/MR by email, we will give you a best price according your plan.
Buy DSPIC33EV64GM106-E/MR with BYCHPS
Buy with guarantee
DSPIC33EV64GM106-E/MR
- Part Number:
- DSPIC33EV64GM106-E/MR
- Manufacturer:
- Micrel / Microchip Technology
- Description:
- IC MCU 16BIT 64KB FLASH 64QFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14860 Pieces
Introduction
Specifications
| Voltage - Supply (Vcc/Vdd): | 4.5 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | 64-QFN (9x9) |
| Speed: | 60 MIPs |
| Series: | Automotive, AEC-Q100, dsPIC™ 33EV |
| RAM Size: | 8K x 8 |
| Program Memory Type: | FLASH |
| Program Memory Size: | 64KB (22K x 24) |
| Peripherals: | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
| Packaging: | Tube |
| Package / Case: | 64-VFQFN Exposed Pad |
| Oscillator Type: | Internal |
| Operating Temperature: | -40°C ~ 125°C (TA) |
| Number of I/O: | 53 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 20 Weeks |
| Manufacturer Part Number: | DSPIC33EV64GM106-E/MR |
| Expanded Description: | dsPIC Automotive, AEC-Q100, dsPIC™ 33EV Microcontroller IC 16-Bit 60 MIPs 64KB (22K x 24) FLASH 64-QFN (9x9) |
| EEPROM Size: | - |
| Description: | IC MCU 16BIT 64KB FLASH 64QFN |
| Data Converters: | A/D 36x10/12b |
| Core Size: | 16-Bit |
| Core Processor: | dsPIC |
| Connectivity: | CAN, I²C, IrDA, LIN, SPI, UART/USART |
| Email: | [email protected] |
Related parts for DSPIC33EV64GM106-E/MR
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog