BYCHIPS is the stocking distributor for DS91C176TMA, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DS91C176TMA by email, we will give you a best price according your plan.
Buy DS91C176TMA with BYCHPS
Buy with guarantee
DS91C176TMA
- Part Number:
- DS91C176TMA
- Manufacturer:
- Description:
- IC TXRX MULTIPOINT-LVDS 8SOIC
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 12125 Pieces
- Data sheet:
- DS91C176TMA.pdf
Introduction
Specifications
| Voltage - Supply: | 3 V ~ 3.6 V |
|---|---|
| Type: | Transceiver |
| Series: | - |
| Protocol: | LVDS |
| Packaging: | Tube |
| Package / Case: | 8-SOIC (0.154", 3.90mm Width) |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Drivers/Receivers: | 1/1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | DS91C176TMA |
| Expanded Description: | 1/1 Transceiver Half LVDS |
| Duplex: | Half |
| Description: | IC TXRX MULTIPOINT-LVDS 8SOIC |
| Data Rate: | 200Mbps |
| Email: | [email protected] |
Related parts for DS91C176TMA
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
|
DS91C176TMA/NOPB | Texas Instruments | IC TXRX MULTIPOINT-LVDS 8SOIC | Inquiry |
|
DS91C176TMAX | Texas Instruments | IC TXRX MULTIPOINT-LVDS 8SOIC | Inquiry |
|
DS91C180TMAX | Texas Instruments | IC LINE DVR/RCV M-LVDS 14SOIC | Inquiry |
|
DS91C180TMAX/NOPB | Texas Instruments | IC LINE DVR/RCV M-LVDS 14SOIC | Inquiry |
 |
FIN1027AM | Fairchild/ON Semiconductor | IC DRIVER 3.3V LVDS HS 8SOIC | Inquiry |
|
DS91C176TMAX/NOPB | Texas Instruments | IC TXRX MULTIPOINT-LVDS 8SOIC | Inquiry |
|
SNSNYLVDSZQLR | Texas Instruments | LVDS INTERFACE IC FLATLINK TRANS | Inquiry |
|
DS91C180TMA/NOPB | Texas Instruments | IC LINE DVR/RCV M-LVDS 14SOIC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers