BYCHIPS is the stocking distributor for DS4520E+TRL, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DS4520E+TRL by email, we will give you a best price according your plan.
Buy DS4520E+TRL with BYCHPS
Buy with guarantee
DS4520E+TRL
- Part Number:
- DS4520E+TRL
- Manufacturer:
- Maxim Integrated
- Description:
- IC I/O EXPANDER I2C 9B 16TSSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16938 Pieces
- Data sheet:
- DS4520E+TRL.pdf
Introduction
Specifications
| Voltage - Supply: | 2.7 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | 16-TSSOP |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 16-TSSOP (0.173", 4.40mm Width) |
| Output Type: | Open Drain |
| Operating Temperature: | -40°C ~ 85°C |
| Number of I/O: | 9 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Manufacturer Part Number: | DS4520E+TRL |
| Interrupt Output: | No |
| Interface: | I²C |
| Features: | EEPROM, POR |
| Expanded Description: | I/O Expander 9 I²C 16-TSSOP |
| Description: | IC I/O EXPANDER I2C 9B 16TSSOP |
| Current - Output Source/Sink: | 12mA |
| Clock Frequency: | 400kHz |
| Email: | [email protected] |
Related parts for DS4520E+TRL
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
DS4520E+ | Maxim Integrated | IC I/O EXPANDER I2C 9B 16TSSOP | Inquiry |
|
DS4520E | Maxim Integrated | IC I/O EXPANDER W/MEMORY 16TSSOP | Inquiry |
 |
CS82C55A-5Z | Intersil | IC I/O EXPANDER 24B 44PLCC | Inquiry |
|
DS4520E-W | Maxim Integrated | IC I/O EXPANDER W/MEMORY 16TSSOP | Inquiry |
 |
MAX7314AEG+ | Maxim Integrated | IC I/O EXPANDER I2C 16B 24QSOP | Inquiry |
 |
PCF8574DWG4 | Texas Instruments | IC I/O EXPANDER I2C 8B 16SOIC | Inquiry |
 |
MAX7312ATG+T | Maxim Integrated | IC I/O EXPANDER I2C 16B 24TQFN | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers