DS34T108GN
Part Number:
DS34T108GN
Manufacturer:
Maxim Integrated
Description:
IC TDM/PACKET CHIP 484-BGA
Lead Free Status / RoHS Status:
Contains lead / RoHS non-compliant
Available Quantity:
14865 Pieces
Data sheet:
DS34T108GN.pdf

Introduction

BYCHIPS is the stocking distributor for DS34T108GN, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DS34T108GN by email, we will give you a best price according your plan.
Buy DS34T108GN with BYCHPS
Buy with guarantee

Specifications

Type:TDM (Time Division Multiplexing)
Supplier Device Package:484-HSBGA (23x23)
Series:-
Packaging:Tray
Package / Case:484-BGA Exposed Pad
Mounting Type:Surface Mount
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Part Number:DS34T108GN
Expanded Description:TDM (Time Division Multiplexing) IC Data Transport 484-HSBGA (23x23)
Description:IC TDM/PACKET CHIP 484-BGA
Applications:Data Transport
Email:[email protected]

Quick Request Quote

Part Number
Quantity
Company
E-mail
Phone
Comments