DS34S132GN+
Part Number:
DS34S132GN+
Manufacturer:
Maxim Integrated
Description:
IC TDM OVER PACKET 676-BGA
Lead Free Status / RoHS Status:
Lead free / RoHS Compliant
Available Quantity:
17015 Pieces
Data sheet:
DS34S132GN+.pdf

Introduction

BYCHIPS is the stocking distributor for DS34S132GN+, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DS34S132GN+ by email, we will give you a best price according your plan.
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Specifications

Voltage - Supply:1.8V, 3.3V
Supplier Device Package:676-PBGA (27x27)
Series:-
Power (Watts):-
Packaging:Tray
Package / Case:676-BGA
Other Names:90-34S13+2N0
Operating Temperature:-40°C ~ 85°C
Number of Circuits:1
Mounting Type:Surface Mount
Moisture Sensitivity Level (MSL):3 (168 Hours)
Manufacturer Standard Lead Time:6 Weeks
Manufacturer Part Number:DS34S132GN+
Interface:TDMoP
Includes:-
Function:TDM-over-Packet (TDMoP)
Expanded Description:Telecom IC TDM-over-Packet (TDMoP) 676-PBGA (27x27)
Description:IC TDM OVER PACKET 676-BGA
Current - Supply:-
Email:[email protected]

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