BYCHIPS is the stocking distributor for DS21S07AE, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DS21S07AE by email, we will give you a best price according your plan.
Buy DS21S07AE with BYCHPS
Buy with guarantee
DS21S07AE
- Part Number:
- DS21S07AE
- Manufacturer:
- Maxim Integrated
- Description:
- IC TERMINATOR SCSI 20-TSSOP
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 19670 Pieces
- Data sheet:
- DS21S07AE.pdf
Introduction
Specifications
| Voltage - Supply: | 4 V ~ 5.5 V |
|---|---|
| Type: | SCSI, LVD, SE |
| Supplier Device Package: | 20-TSSOP |
| Series: | - |
| Packaging: | Tube |
| Package / Case: | 20-TSSOP (0.173", 4.40mm Width) |
| Operating Temperature: | 0°C ~ 70°C |
| Number of Terminations: | 9 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | DS21S07AE |
| Expanded Description: | SCSI, LVD, SE Terminator Terminations 20-TSSOP |
| Description: | IC TERMINATOR SCSI 20-TSSOP |
| Email: | [email protected] |
Related parts for DS21S07AE
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
DS21S07AS/T&R | Maxim Integrated | IC TERMINATOR SCSI 16-SOIC | Inquiry |
|
DS21S07AS | Maxim Integrated | IC TERMINATOR SCSI 16-SOIC | Inquiry |
 |
DS21S07AE/T&R | Maxim Integrated | IC TERMINATOR SCSI 20-TSSOP | Inquiry |
|
DS21S07AE+T&R | Maxim Integrated | IC TERMINATOR SCSI 20-TSSOP | Inquiry |
|
DS21S07AS+ | Maxim Integrated | IC TERMINATOR SCSI 16-SOIC | Inquiry |
|
DS21S07AE+ | Maxim Integrated | IC TERMINATOR SCSI 20-TSSOP | Inquiry |
|
DS21S07AS+T&R | Maxim Integrated | IC TERMINATOR SCSI 16-SOIC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers