BYCHIPS is the stocking distributor for CY62157DV30L-55ZSXE, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CY62157DV30L-55ZSXE by email, we will give you a best price according your plan.
Buy CY62157DV30L-55ZSXE with BYCHPS
Buy with guarantee
CY62157DV30L-55ZSXE
- Part Number:
- CY62157DV30L-55ZSXE
- Manufacturer:
- Cypress Semiconductor
- Description:
- IC SRAM 8MBIT 55NS 44TSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16724 Pieces
- Data sheet:
- CY62157DV30L-55ZSXE.pdf
Introduction
Specifications
| Voltage - Supply: | 2.2 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 44-TSOP II |
| Speed: | 55ns |
| Series: | MoBL® |
| Packaging: | Tray |
| Package / Case: | 44-TSOP (0.400", 10.16mm Width) |
| Operating Temperature: | -40°C ~ 125°C (TA) |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Memory Type: | Volatile |
| Memory Size: | 8Mb (512K x 16) |
| Memory Format: | SRAM |
| Manufacturer Part Number: | CY62157DV30L-55ZSXE |
| Interface: | Parallel |
| Description: | IC SRAM 8MBIT 55NS 44TSOP |
| Email: | [email protected] |
Related parts for CY62157DV30L-55ZSXE
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
CY62157DV30LL-55BVXA | Cypress Semiconductor Corp | IC SRAM 8MBIT 55NS 48VFBGA | Inquiry |
|
CY62157DV30L-55BVXE | Cypress Semiconductor Corp | IC SRAM 8MBIT 55NS 48VFBGA | Inquiry |
|
CY62157DV30LL-55BVXI | Cypress Semiconductor Corp | IC SRAM 8MBIT 55NS 48VFBGA | Inquiry |
 |
CY62157DV30L-55ZSXET | Cypress Semiconductor Corp | IC SRAM 8MBIT 55NS 44TSOP | Inquiry |
|
CY62157DV30LL-55ZSXI | Cypress Semiconductor Corp | IC SRAM 8MBIT 55NS 44TSOP | Inquiry |
|
CY62157DV30L-55BVXET | Cypress Semiconductor Corp | IC SRAM 8MBIT 55NS 48VFBGA | Inquiry |
|
CY62157DV30LL-55BVXAT | Cypress Semiconductor Corp | IC SRAM 8MBIT 55NS 48VFBGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers