BYCHIPS is the stocking distributor for CQ82C55AZ, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CQ82C55AZ by email, we will give you a best price according your plan.
Buy CQ82C55AZ with BYCHPS
Buy with guarantee
CQ82C55AZ
- Part Number:
- CQ82C55AZ
- Manufacturer:
- Intersil
- Description:
- IC I/O EXPANDER 24B 44MQFP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14590 Pieces
- Data sheet:
- CQ82C55AZ.pdf
Introduction
Specifications
| Voltage - Supply: | 4.5 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | 44-MQFP (10x10) |
| Series: | - |
| Packaging: | Tray |
| Package / Case: | 44-QFP |
| Output Type: | Open Drain |
| Operating Temperature: | 0°C ~ 70°C |
| Number of I/O: | 24 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 7 Weeks |
| Manufacturer Part Number: | CQ82C55AZ |
| Interrupt Output: | No |
| Interface: | Parallel |
| Features: | - |
| Expanded Description: | I/O Expander 24 Parallel 44-MQFP (10x10) |
| Description: | IC I/O EXPANDER 24B 44MQFP |
| Current - Output Source/Sink: | 2.5mA |
| Email: | [email protected] |
Related parts for CQ82C55AZ
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
PCA9673DB,118 | NXP USA Inc. | IC I/O EXPANDER I2C 16B 24SSOP | Inquiry |
 |
MAX7322ATE+T | Maxim Integrated | IC I/O EXPANDER I2C 4B 16TQFN | Inquiry |
 |
CQ82C55A | Intersil | IC I/O EXPANDER 24B 44MQFP | Inquiry |
 |
MAX7318ATG+ | Maxim Integrated | IC I/O EXPANDER I2C 16B 24TQFN | Inquiry |
|
CQ82C55A96 | Intersil | IC I/O EXPANDER 24B 44MQFP | Inquiry |
|
PCA6416AEVJ | NXP USA Inc. | IC I/O EXPANDER 16BIT 24VFBGA | Inquiry |
 |
XRA1405IG24-F | Exar Corporation | IC I/O EXPANDER SPI 16B 24TSSOP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers