BYCHIPS is the stocking distributor for CGS74CT2525N, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CGS74CT2525N by email, we will give you a best price according your plan.
Buy CGS74CT2525N with BYCHPS
Buy with guarantee
CGS74CT2525N
- Part Number:
- CGS74CT2525N
- Manufacturer:
- Description:
- IC CLK BUFFER 1:8 14DIP
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 14828 Pieces
- Data sheet:
- CGS74CT2525N.pdf
Introduction
Specifications
| Voltage - Supply: | 4.5 V ~ 5.5 V |
|---|---|
| Type: | Fanout Buffer (Distribution) |
| Supplier Device Package: | 14-DIP |
| Series: | 74CT |
| Ratio - Input:Output: | 1:8 |
| Packaging: | Tube |
| Package / Case: | 14-DIP (0.300", 7.62mm) |
| Output: | CMOS, TTL |
| Other Names: | *CGS74CT2525N |
| Operating Temperature: | 0°C ~ 70°C |
| Number of Circuits: | 1 |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | CGS74CT2525N |
| Input: | CMOS, TTL |
| Frequency - Max: | - |
| Expanded Description: | Clock Fanout Buffer (Distribution) IC 14-DIP (0.300", 7.62mm) |
| Differential - Input:Output: | No/No |
| Description: | IC CLK BUFFER 1:8 14DIP |
| Email: | [email protected] |
Related parts for CGS74CT2525N
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
|
CGS74CT2525M | Texas Instruments | IC CLK BUFFER 1:8 14SOIC | Inquiry |
|
CGS74CT2525MX | Texas Instruments | IC CLK BUFFER 1:8 14SOIC | Inquiry |
|
CGS74LCT2524M | Texas Instruments | IC CLK BUFFER 1:4 75MHZ 8SOIC | Inquiry |
|
CGS74CT2524M | Texas Instruments | IC CLK BUFFER 1:4 100MHZ 8SOIC | Inquiry |
|
CGS74CT2524MX | Texas Instruments | IC CLK BUFFER 1:4 100MHZ 8SOIC | Inquiry |
|
CGS74C2525MX | Texas Instruments | IC CLK BUFFER 1:8 14SOIC | Inquiry |
|
CGS74LCT2524MX | Texas Instruments | IC CLK BUFFER 1:4 75MHZ 8SOIC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers