BYCHIPS is the stocking distributor for CGA9P1X7S3D103K250KE, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CGA9P1X7S3D103K250KE by email, we will give you a best price according your plan.
Buy CGA9P1X7S3D103K250KE with BYCHPS
Buy with guarantee
CGA9P1X7S3D103K250KE
- Part Number:
- CGA9P1X7S3D103K250KE
- Manufacturer:
- TDK Corporation
- Description:
- CAP CER 10000PF 2KV X7S 2220
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13966 Pieces
Introduction
Specifications
| Voltage - Rated: | 2000V (2kV) |
|---|---|
| Tolerance: | ±10% |
| Thickness (Max): | 0.110" (2.80mm) |
| Temperature Coefficient: | X7S |
| Size / Dimension: | 0.224" L x 0.197" W (5.70mm x 5.00mm) |
| Series: | CGA |
| Ratings: | AEC-Q200 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 2220 (5750 Metric) |
| Other Names: | 445-13176-2 CGA9P1X7S3D103KT0Y0S |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 20 Weeks |
| Manufacturer Part Number: | CGA9P1X7S3D103K250KE |
| Lead Style: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | - |
| Features: | Soft Termination |
| Failure Rate: | - |
| Expanded Description: | 10000pF ±10% 2000V (2kV) Ceramic Capacitor X7S 2220 (5750 Metric) |
| Description: | CAP CER 10000PF 2KV X7S 2220 |
| Capacitance: | 10000pF |
| Applications: | Automotive, Boardflex Sensitive |
| Email: | [email protected] |
Related parts for CGA9P1X7S3D103K250KE
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
CGA9P1X7S3D103M250KE | TDK Corporation | CAP CER 10000PF 2KV X7S 2220 | Inquiry |
|
CGA9P1X7S3A473K250KA | TDK Corporation | CAP CER 0.047UF 1KV X7S 2220 | Inquiry |
|
CGA9P1X7S3D103K250KA | TDK Corporation | CAP CER 10000PF 2KV X7S 2220 | Inquiry |
|
CGA9P1X7S3D103M250KA | TDK Corporation | CAP CER 10000PF 2KV X7S 2220 | Inquiry |
|
CGA9P1X7T2J474M250KC | TDK Corporation | CAP CER 0.47UF 630V X7T 2220 | Inquiry |
 |
CGA9P1X7T2J474K250KC | TDK Corporation | CAP CER 0.47UF 630V X7T 2220 | Inquiry |
|
CGA9P1X7T2J474M250KE | TDK Corporation | CAP CER 0.47UF 630V X7T 2220 | Inquiry |
|
CGA9P1X7S3A473M250KA | TDK Corporation | CAP CER 0.047UF 1KV X7S 2220 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers