BYCHIPS is the stocking distributor for CGA8P3X7R1H685K250KB, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CGA8P3X7R1H685K250KB by email, we will give you a best price according your plan.
Buy CGA8P3X7R1H685K250KB with BYCHPS
Buy with guarantee
CGA8P3X7R1H685K250KB
- Part Number:
- CGA8P3X7R1H685K250KB
- Manufacturer:
- TDK Corporation
- Description:
- CAP CER 6.8UF 50V X7R 1812
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15342 Pieces
Introduction
Specifications
| Voltage - Rated: | 50V |
|---|---|
| Tolerance: | ±10% |
| Thickness (Max): | 0.098" (2.50mm) |
| Temperature Coefficient: | X7R |
| Size / Dimension: | 0.177" L x 0.126" W (4.50mm x 3.20mm) |
| Series: | CGA |
| Ratings: | AEC-Q200 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1812 (4532 Metric) |
| Other Names: | 445-7907-2 CGA8P3X7R1H685K CGA8P3X7R1H685KT0Y0N |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 20 Weeks |
| Manufacturer Part Number: | CGA8P3X7R1H685K250KB |
| Lead Style: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | - |
| Features: | - |
| Failure Rate: | - |
| Expanded Description: | 6.8µF ±10% 50V Ceramic Capacitor X7R 1812 (4532 Metric) |
| Description: | CAP CER 6.8UF 50V X7R 1812 |
| Capacitance: | 6.8µF |
| Applications: | Automotive |
| Email: | [email protected] |
Related parts for CGA8P3X7R1H685K250KB
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog