BYCHIPS is the stocking distributor for CGA4J3X7R1C475K125AE, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CGA4J3X7R1C475K125AE by email, we will give you a best price according your plan.
Buy CGA4J3X7R1C475K125AE with BYCHPS
Buy with guarantee
CGA4J3X7R1C475K125AE
- Part Number:
- CGA4J3X7R1C475K125AE
- Manufacturer:
- TDK Corporation
- Description:
- CAP CER 4.7UF 16V X7R 0805
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15828 Pieces
Introduction
Specifications
| Voltage - Rated: | 16V |
|---|---|
| Tolerance: | ±10% |
| Thickness (Max): | 0.057" (1.45mm) |
| Temperature Coefficient: | X7R |
| Size / Dimension: | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| Series: | CGA |
| Ratings: | AEC-Q200 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 0805 (2012 Metric) |
| Other Names: | 445-8788-2 CGA4J3X7R1C475K/SOFT CGA4J3X7R1C475KT0Y0S |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | CGA4J3X7R1C475K125AE |
| Lead Style: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | - |
| Features: | Soft Termination |
| Failure Rate: | - |
| Expanded Description: | 4.7µF ±10% 16V Ceramic Capacitor X7R 0805 (2012 Metric) |
| Description: | CAP CER 4.7UF 16V X7R 0805 |
| Capacitance: | 4.7µF |
| Applications: | Automotive, Boardflex Sensitive |
| Email: | [email protected] |
Related parts for CGA4J3X7R1C475K125AE
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
CGA4J3X7R1C475M125AD | TDK Corporation | CAP CER 4.7UF 16V X7R 0805 | Inquiry |
 |
CGA4J3X7R1C475K125AB | TDK Corporation | CAP CER 4.7UF 16V X7R 0805 | Inquiry |
|
CGA4J3X7R1C475K125AD | TDK Corporation | CAP CER 4.7UF 16V X7R 0805 | Inquiry |
|
CGA4J3X7R1C475M125AB | TDK Corporation | CAP CER 4.7UF 16V X7R 0805 | Inquiry |
|
CGA4J3X7R1C475M125AE | TDK Corporation | CAP CER 4.7UF 16V X7R 0805 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers