BYCHIPS is the stocking distributor for CGA1206MLA-40181E, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CGA1206MLA-40181E by email, we will give you a best price according your plan.
Buy CGA1206MLA-40181E with BYCHPS
Buy with guarantee
CGA1206MLA-40181E
- Part Number:
- CGA1206MLA-40181E
- Manufacturer:
- Bourns, Inc.
- Description:
- VARISTOR 70V 200A 1206
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17997 Pieces
Introduction
Specifications
| Varistor Voltage (Typ): | 70V |
|---|---|
| Varistor Voltage (Min): | 63V |
| Varistor Voltage (Max): | 77V |
| Series: | ChipGuard® |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1206 (3216 Metric) |
| Operating Temperature: | -55°C ~ 125°C (TA) |
| Number of Circuits: | 1 |
| Mounting Type: | Surface Mount, MLCV |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Maximum DC Volts: | 56VDC |
| Maximum AC Volts: | 40VAC |
| Manufacturer Standard Lead Time: | 17 Weeks |
| Manufacturer Part Number: | CGA1206MLA-40181E |
| Energy: | 1.0J |
| Description: | VARISTOR 70V 200A 1206 |
| Current - Surge: | 200A |
| Capacitance @ Frequency: | 180pF @ 1kHz |
| Email: | [email protected] |
Related parts for CGA1206MLA-40181E
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
CGA1206MLA-22651E | Bourns Inc. | VARISTOR 27.5V 200A 1206 | Inquiry |
|
CGA1206MLA-38501E | Bourns Inc. | VARISTOR 47.5V 200A 1206 | Inquiry |
|
CGA1206MLA-26601E | Bourns Inc. | VARISTOR 33.5V 200A 1206 | Inquiry |
|
CGA1206MLA-31551E | Bourns Inc. | VARISTOR 39.5V 200A 1206 | Inquiry |
|
CGA1206MLA-16801E | Bourns Inc. | VARISTOR 25V 200A 1206 | Inquiry |
|
CGA1206MLA-16701E | Bourns Inc. | VARISTOR 22.5V 200A 1206 | Inquiry |
|
CGA1206MLA-22841E | Bourns Inc. | VARISTOR 27V 100A 1206 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers