BYCHIPS is the stocking distributor for CDLL3600, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CDLL3600 by email, we will give you a best price according your plan.
Buy CDLL3600 with BYCHPS
Buy with guarantee
CDLL3600
- Part Number:
- CDLL3600
- Manufacturer:
- Microsemi
- Description:
- DIODE GEN PURP 50V 300MA DO213AA
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 14524 Pieces
- Data sheet:
- CDLL3600.pdf
Introduction
Specifications
| Voltage - Forward (Vf) (Max) @ If: | 680mV @ 10mA |
|---|---|
| Voltage - DC Reverse (Vr) (Max): | 50V |
| Supplier Device Package: | DO-213AA |
| Speed: | Fast Recovery = 200mA (Io) |
| Series: | - |
| Reverse Recovery Time (trr): | 4ns |
| Packaging: | Bulk |
| Package / Case: | DO-213AA |
| Other Names: | 1086-1198 1086-1198-MIL |
| Operating Temperature - Junction: | -65°C ~ 175°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | CDLL3600 |
| Expanded Description: | Diode Standard 50V 300mA Surface Mount DO-213AA |
| Diode Type: | Standard |
| Description: | DIODE GEN PURP 50V 300MA DO213AA |
| Current - Reverse Leakage @ Vr: | 100nA @ 50V |
| Current - Average Rectified (Io): | 300mA |
| Capacitance @ Vr, F: | 2.5pF @ 0V, 1MHz |
| Email: | [email protected] |
Related parts for CDLL3600
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers