BYCHIPS is the stocking distributor for CDEP12D38NP-3R2MC-88, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CDEP12D38NP-3R2MC-88 by email, we will give you a best price according your plan.
Buy CDEP12D38NP-3R2MC-88 with BYCHPS
Buy with guarantee
CDEP12D38NP-3R2MC-88
- Part Number:
- CDEP12D38NP-3R2MC-88
- Manufacturer:
- Sumida Corporation
- Description:
- FIXED IND 3.2UH 8.5A 11.2 MOHM
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18886 Pieces
- Data sheet:
- CDEP12D38NP-3R2MC-88.pdf
Introduction
Specifications
| Type: | Wirewound |
|---|---|
| Tolerance: | ±20% |
| Supplier Device Package: | - |
| Size / Dimension: | 0.492" L x 0.492" W (12.50mm x 12.50mm) |
| Shielding: | Shielded |
| Series: | CDEP12D38 |
| Ratings: | - |
| Q @ Freq: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | Nonstandard |
| Operating Temperature: | -40°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Ferrite |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | CDEP12D38NP-3R2MC-88 |
| Inductance: | 3.2µH |
| Height - Seated (Max): | 0.157" (4.00mm) |
| Frequency - Test: | 100kHz |
| Frequency - Self Resonant: | - |
| Expanded Description: | 3.2µH Shielded Wirewound Inductor 8.5A 11.2 mOhm Max Nonstandard |
| Description: | FIXED IND 3.2UH 8.5A 11.2 MOHM |
| DC Resistance (DCR): | 11.2 mOhm Max |
| Current Rating: | 8.5A |
| Current - Saturation: | 9.2A |
| Email: | [email protected] |
Related parts for CDEP12D38NP-3R2MC-88
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers