BYCHIPS is the stocking distributor for CDCL1810ARGZT, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CDCL1810ARGZT by email, we will give you a best price according your plan.
Buy CDCL1810ARGZT with BYCHPS
Buy with guarantee
CDCL1810ARGZT
- Part Number:
- CDCL1810ARGZT
- Manufacturer:
- Description:
- IC CLK BUFFER 1:10 650MHZ 48VQFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17403 Pieces
- Data sheet:
- CDCL1810ARGZT.pdf
Introduction
Specifications
| Voltage - Supply: | 1.7 V ~ 1.9 V |
|---|---|
| Type: | Fanout Buffer (Distribution), Divider |
| Supplier Device Package: | 48-VQFN (7x7) |
| Series: | - |
| Ratio - Input:Output: | 1:10 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 48-VFQFN Exposed Pad |
| Output: | CML |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Circuits: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 11 Weeks |
| Manufacturer Part Number: | CDCL1810ARGZT |
| Input: | LVDS |
| Frequency - Max: | 650MHz |
| Expanded Description: | Clock Fanout Buffer (Distribution), Divider IC 650MHz 48-VFQFN Exposed Pad |
| Differential - Input:Output: | Yes/Yes |
| Description: | IC CLK BUFFER 1:10 650MHZ 48VQFN |
| Email: | [email protected] |
Related parts for CDCL1810ARGZT
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
|
CDCL1810RGZRG4 | Texas Instruments | IC CLK BUFFER 1:10 650MHZ 48VQFN | Inquiry |
|
CDCL1810RGZTG4 | Texas Instruments | IC CLK BUFFER 1:10 650MHZ 48VQFN | Inquiry |
|
CDCL1810RGZR | Texas Instruments | IC CLK BUFFER 1:10 650MHZ 48VQFN | Inquiry |
|
CDCL1810RGZT | Texas Instruments | IC CLK BUFFER 1:10 650MHZ 48VQFN | Inquiry |
|
CDCL1810ARGZR | Texas Instruments | IC CLK BUFFER 1:10 650MHZ 48VQFN | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers