BYCHIPS is the stocking distributor for CBT3125D,112, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CBT3125D,112 by email, we will give you a best price according your plan.
Buy CBT3125D,112 with BYCHPS
Buy with guarantee
CBT3125D,112
- Part Number:
- CBT3125D,112
- Manufacturer:
- Nexperia
- Description:
- IC FET BUS SWITCH QUAD 14SOIC
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14820 Pieces
- Data sheet:
- CBT3125D,112.pdf
Introduction
Specifications
| Voltage Supply Source: | Single Supply |
|---|---|
| Voltage - Supply: | 4.5 V ~ 5.5 V |
| Type: | Bus Switch |
| Supplier Device Package: | 14-SO |
| Series: | 74CBT |
| Packaging: | Tube |
| Package / Case: | 14-SOIC (0.154", 3.90mm Width) |
| Other Names: | 935270672112 CBT3125D CBT3125D-ND |
| Operating Temperature: | -40°C ~ 85°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | CBT3125D,112 |
| Independent Circuits: | 4 |
| Expanded Description: | Bus Switch 1 x 1:1 14-SO |
| Description: | IC FET BUS SWITCH QUAD 14SOIC |
| Current - Output High, Low: | - |
| Circuit: | 1 x 1:1 |
| Email: | [email protected] |
Related parts for CBT3125D,112
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
CBT3125PW,118 | Nexperia USA Inc. | IC FET BUS SWITCH QUAD 14TSSOP | Inquiry |
|
CBT3125DS,118 | Nexperia USA Inc. | IC FET BUS SWITCH QUAD 16QSOP | Inquiry |
 |
CBT3125DB,118 | Nexperia USA Inc. | IC FET BUS SWITCH QUAD 14SSOP | Inquiry |
 |
CBT3125D,118 | Nexperia USA Inc. | IC FET BUS SWITCH QUAD 14SOIC | Inquiry |
|
CBT3125PW,112 | Nexperia USA Inc. | IC FET BUS SWITCH QUAD 14TSSOP | Inquiry |
|
CBT3125DS,112 | Nexperia USA Inc. | IC FET BUS SWITCH QUAD 16QSOP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers