BYCHIPS is the stocking distributor for BZ254B223ZSBCE, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BZ254B223ZSBCE by email, we will give you a best price according your plan.
Buy BZ254B223ZSBCE with BYCHPS
Buy with guarantee
BZ254B223ZSBCE
- Part Number:
- BZ254B223ZSBCE
- Manufacturer:
- AVX Corporation
- Description:
- CAP 22MF -20% +80% 4V SMD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14656 Pieces
- Data sheet:
- BZ254B223ZSBCE.pdf
Introduction
Specifications
| Voltage - Rated: | 4V |
|---|---|
| Tolerance: | -20%, +80% |
| Termination: | Solder Tabs |
| Size / Dimension: | 0.787" L x 0.591" W (20.00mm x 15.00mm) |
| Series: | BestCap® BZ |
| Packaging: | Bulk |
| Package / Case: | BZ25, 3 Lead |
| Other Names: | 478-5411 |
| Operating Temperature: | -20°C ~ 70°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | BZ254B223ZSBCE |
| Lifetime @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | - |
| Height - Seated (Max): | 0.075" (1.90mm) |
| Expanded Description: | 22mF -20%, +80%(EDLC) Supercapacitor 4V BZ25, 3 Lead 140 mOhm 1000 Hrs @ 70°C |
| ESR (Equivalent Series Resistance): | 140 mOhm |
| Description: | CAP 22MF -20% +80% 4V SMD |
| Capacitance: | 22mF |
| Email: | [email protected] |
Related parts for BZ254B223ZSBCE
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
EMHSR-0001C5-005R0 | NessCap Co Ltd | CAP 1.5F -10% +20% 5V T/H | Inquiry |
 |
BCAP0650 P270 K04 | Maxwell Technologies Inc. | CAP 650F 2.7V THREADED | Inquiry |
 |
BCAP0100 P270 T07 | Maxwell Technologies Inc. | CAP 100F 2.7V THROUGH HOLE | Inquiry |
 |
PM-5R0H105-R | Eaton | CAP 1F -20% +80% 5V T/H | Inquiry |
 |
FR0H223ZF | KEMET | CAP 22MF -20% +80% 5.5V T/H | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers