BYCHIPS is the stocking distributor for BYV42EB-200,118, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BYV42EB-200,118 by email, we will give you a best price according your plan.
Buy BYV42EB-200,118 with BYCHPS
Buy with guarantee
BYV42EB-200,118
- Part Number:
- BYV42EB-200,118
- Manufacturer:
- WeEn Semiconductors Co., Ltd
- Description:
- DIODE ARRAY GP 200V 30A D2PAK
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13504 Pieces
- Data sheet:
- BYV42EB-200,118.pdf
Introduction
Specifications
| Voltage - Forward (Vf) (Max) @ If: | 1.2V @ 30A |
|---|---|
| Voltage - DC Reverse (Vr) (Max): | 200V |
| Supplier Device Package: | D2PAK |
| Speed: | Fast Recovery = 200mA (Io) |
| Series: | - |
| Reverse Recovery Time (trr): | 28ns |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Other Names: | 934041920118 BYV42EB-200 /T3 BYV42EB-200 /T3-ND |
| Operating Temperature - Junction: | 150°C (Max) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | BYV42EB-200,118 |
| Expanded Description: | Diode Array 1 Pair Common Cathode Standard 200V 30A Surface Mount TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Diode Type: | Standard |
| Diode Configuration: | 1 Pair Common Cathode |
| Description: | DIODE ARRAY GP 200V 30A D2PAK |
| Current - Reverse Leakage @ Vr: | 100µA @ 200V |
| Current - Average Rectified (Io) (per Diode): | 30A |
| Email: | [email protected] |
Related parts for BYV42EB-200,118
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers