BYCHIPS is the stocking distributor for BYV32E-100,127, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BYV32E-100,127 by email, we will give you a best price according your plan.
Buy BYV32E-100,127 with BYCHPS
Buy with guarantee
BYV32E-100,127
- Part Number:
- BYV32E-100,127
- Manufacturer:
- WeEn Semiconductors Co., Ltd
- Description:
- DIODE ARRAY GP 100V 20A TO220AB
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17247 Pieces
- Data sheet:
- BYV32E-100,127.pdf
Introduction
Specifications
| Voltage - Forward (Vf) (Max) @ If: | 1.15V @ 20A |
|---|---|
| Voltage - DC Reverse (Vr) (Max): | 100V |
| Supplier Device Package: | TO-220AB |
| Speed: | Fast Recovery = 200mA (Io) |
| Series: | - |
| Reverse Recovery Time (trr): | 25ns |
| Packaging: | Tube |
| Package / Case: | TO-220-3 |
| Other Names: | 1740-1287 568-3435-5 568-3435-5-ND 934011670127 BYV32E-100 |
| Operating Temperature - Junction: | 150°C (Max) |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | BYV32E-100,127 |
| Expanded Description: | Diode Array 1 Pair Common Cathode Standard 100V 20A Through Hole TO-220-3 |
| Diode Type: | Standard |
| Diode Configuration: | 1 Pair Common Cathode |
| Description: | DIODE ARRAY GP 100V 20A TO220AB |
| Current - Reverse Leakage @ Vr: | 30µA @ 100V |
| Current - Average Rectified (Io) (per Diode): | 20A |
| Email: | [email protected] |
Related parts for BYV32E-100,127
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers