BYCHIPS is the stocking distributor for BU26156RFS-E2, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BU26156RFS-E2 by email, we will give you a best price according your plan.
Buy BU26156RFS-E2 with BYCHPS
Buy with guarantee
BU26156RFS-E2
- Part Number:
- BU26156RFS-E2
- Manufacturer:
- LAPIS Semiconductor
- Description:
- IC AUDIO CODEC 24BIT 44HTSSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14541 Pieces
- Data sheet:
- BU26156RFS-E2.pdf
Introduction
Specifications
| Voltage - Supply, Digital: | 2.7 V ~ 3.6 V |
|---|---|
| Voltage - Supply, Analog: | 2.7 V ~ 3.6 V |
| Type: | Audio |
| Supplier Device Package: | HTSSOP-A44R |
| Sigma Delta: | No |
| Series: | - |
| S/N Ratio, ADCs / DACs (db) Typ: | 93 / 95 |
| Resolution (Bits): | 24 b |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 44-VSOP (0.295", 7.50mm Width) Exposed Pad |
| Other Names: | BU26156RFS-E2TR |
| Operating Temperature: | -20°C ~ 85°C |
| Number of ADCs / DACs: | 2 / 2 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 11 Weeks |
| Manufacturer Part Number: | BU26156RFS-E2 |
| Expanded Description: | Audio Interface 24 b Serial HTSSOP-A44R |
| Dynamic Range, ADCs / DACs (db) Typ: | - |
| Description: | IC AUDIO CODEC 24BIT 44HTSSOP |
| Data Interface: | Serial |
| Email: | [email protected] |
Related parts for BU26156RFS-E2
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
ETC5057D-X/HTR | STMicroelectronics | IC SERIAL CODEC/FILTER SO-16W | Inquiry |
 |
BU26154MUV-E2 | Rohm Semiconductor | IC AUDIO CODEC 24BIT 40VQFN | Inquiry |
 |
TWL6040A3SRSZQZ | Texas Instruments | IC AUDIO CODEC 8CH LP 120BGA | Inquiry |
|
PCM2902CDBR | Texas Instruments | IC STEREO AUD CODEC W/USB 28SSOP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers