BYCHIPS is the stocking distributor for BSS169H6327XTSA1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BSS169H6327XTSA1 by email, we will give you a best price according your plan.
Buy BSS169H6327XTSA1 with BYCHPS
Buy with guarantee
BSS169H6327XTSA1
- Part Number:
- BSS169H6327XTSA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- MOSFET N-CH 100V 170MA SOT23
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16939 Pieces
- Data sheet:
- BSS169H6327XTSA1.pdf
Introduction
Specifications
| Vgs(th) (Max) @ Id: | 1.8V @ 50µA |
|---|---|
| Vgs (Max): | ±20V |
| Technology: | MOSFET (Metal Oxide) |
| Supplier Device Package: | PG-SOT23-3 |
| Series: | SIPMOS® |
| Rds On (Max) @ Id, Vgs: | 6 Ohm @ 170mA, 10V |
| Power Dissipation (Max): | 360mW (Ta) |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | TO-236-3, SC-59, SOT-23-3 |
| Other Names: | BSS169 H6327 BSS169 H6327-ND BSS169 H6327TR BSS169 H6327TR-ND SP000702572 |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | BSS169H6327XTSA1 |
| Input Capacitance (Ciss) (Max) @ Vds: | 68pF @ 25V |
| Gate Charge (Qg) (Max) @ Vgs: | 2.8nC @ 7V |
| FET Type: | N-Channel |
| FET Feature: | Depletion Mode |
| Expanded Description: | N-Channel 100V 170mA (Ta) 360mW (Ta) Surface Mount PG-SOT23-3 |
| Drive Voltage (Max Rds On, Min Rds On): | - |
| Drain to Source Voltage (Vdss): | 100V |
| Description: | MOSFET N-CH 100V 170MA SOT23 |
| Current - Continuous Drain (Id) @ 25°C: | 170mA (Ta) |
| Email: | [email protected] |
Related parts for BSS169H6327XTSA1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers