BYCHIPS is the stocking distributor for BFN18E6327HTSA1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BFN18E6327HTSA1 by email, we will give you a best price according your plan.
Buy BFN18E6327HTSA1 with BYCHPS
Buy with guarantee
BFN18E6327HTSA1
- Part Number:
- BFN18E6327HTSA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- TRANS NPN 300V 0.2A SOT-89
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12509 Pieces
- Data sheet:
- BFN18E6327HTSA1.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 300V |
|---|---|
| Vce Saturation (Max) @ Ib, Ic: | 500mV @ 2mA, 20mA |
| Transistor Type: | NPN |
| Supplier Device Package: | PG-SOT89 |
| Series: | - |
| Power - Max: | 1W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | TO-243AA |
| Other Names: | BFN 18 E6327 BFN 18 E6327-ND BFN 18 E6327TR-ND BFN18E6327 BFN18E6327BTSA1 BFN18E6327XT SP000010997 |
| Operating Temperature: | 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | BFN18E6327HTSA1 |
| Frequency - Transition: | 70MHz |
| Expanded Description: | Bipolar (BJT) Transistor NPN 300V 200mA 70MHz 1W Surface Mount PG-SOT89 |
| Description: | TRANS NPN 300V 0.2A SOT-89 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 30 @ 30mA, 10V |
| Current - Collector Cutoff (Max): | 100nA (ICBO) |
| Current - Collector (Ic) (Max): | 200mA |
| Email: | [email protected] |
Related parts for BFN18E6327HTSA1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers