BYCHIPS is the stocking distributor for BFC242011004, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BFC242011004 by email, we will give you a best price according your plan.
Buy BFC242011004 with BYCHPS
Buy with guarantee
BFC242011004
- Part Number:
- BFC242011004
- Manufacturer:
- Angstrohm / Vishay
- Description:
- CAP FILM 0.1UF 2% 630VDC RADIAL
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17471 Pieces
- Data sheet:
- BFC242011004.pdf
Introduction
Specifications
| Voltage Rating - DC: | 630V |
|---|---|
| Voltage Rating - AC: | 160V |
| Tolerance: | ±2% |
| Termination: | PC Pins |
| Size / Dimension: | 0.689" L x 0.335" W (17.50mm x 8.50mm) |
| Series: | MKP420 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | Radial |
| Other Names: | 2222 420 11004 222242011004 BFC2 420 11004 BFC2 420 11004 |
| Operating Temperature: | -55°C ~ 85°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 23 Weeks |
| Manufacturer Part Number: | BFC242011004 |
| Lead Spacing: | 0.591" (15.00mm) |
| Height - Seated (Max): | 0.591" (15.00mm) |
| Features: | - |
| Expanded Description: | 0.1µF ±2% Film Capacitor 160V 630V Polypropylene (PP), Metallized Radial |
| ESR (Equivalent Series Resistance): | - |
| Dielectric Material: | Polypropylene (PP), Metallized |
| Description: | CAP FILM 0.1UF 2% 630VDC RADIAL |
| Capacitance: | 0.1µF |
| Applications: | High Frequency, Switching |
| Email: | [email protected] |
Related parts for BFC242011004
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers