BYCHIPS is the stocking distributor for BD63725BEFV-E2, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BD63725BEFV-E2 by email, we will give you a best price according your plan.
Buy BD63725BEFV-E2 with BYCHPS
Buy with guarantee
BD63725BEFV-E2
- Part Number:
- BD63725BEFV-E2
- Manufacturer:
- LAPIS Semiconductor
- Description:
- IC STEP MOTOR DRVR PAR 28HTSSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19928 Pieces
- Data sheet:
- BD63725BEFV-E2.pdf
Introduction
Specifications
| Voltage - Supply: | 19 V ~ 28 V |
|---|---|
| Voltage - Load: | 19 V ~ 28 V |
| Technology: | DMOS |
| Supplier Device Package: | 28-HTSSOP-B |
| Step Resolution: | 1, 1/2, 1/4 |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 28-VSSOP (0.173", 4.40mm Width) Exposed Pad |
| Output Configuration: | Half Bridge (4) |
| Other Names: | BD63725BEFV-E2TR |
| Operating Temperature: | -25°C ~ 85°C (TA) |
| Mounting Type: | Surface Mount |
| Motor Type - Stepper: | Bipolar |
| Motor Type - AC, DC: | - |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 17 Weeks |
| Manufacturer Part Number: | BD63725BEFV-E2 |
| Interface: | Parallel |
| Function: | Driver - Fully Integrated, Control and Power Stage |
| Expanded Description: | Bipolar Motor Driver DMOS Parallel 28-HTSSOP-B |
| Description: | IC STEP MOTOR DRVR PAR 28HTSSOP |
| Current - Output: | 2.4A |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for BD63725BEFV-E2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers