BYCHIPS is the stocking distributor for BCAP0350 E270 T11, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BCAP0350 E270 T11 by email, we will give you a best price according your plan.
Buy BCAP0350 E270 T11 with BYCHPS
Buy with guarantee
BCAP0350 E270 T11
- Part Number:
- BCAP0350 E270 T11
- Manufacturer:
- Maxwell Technologies, Inc.
- Description:
- CAP 350F 2.7V THROUGH HOLE
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13673 Pieces
- Data sheet:
- BCAP0350 E270 T11.pdf
Introduction
Specifications
| Voltage - Rated: | 2.7V |
|---|---|
| Tolerance: | - |
| Termination: | Through Hole |
| Size / Dimension: | 1.311" Dia (33.30mm) |
| Series: | BC |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Other Names: | 108756 1182-1016 BCAP0350E270T11 |
| Operating Temperature: | -40°C ~ 65°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 4 Weeks |
| Manufacturer Part Number: | BCAP0350 E270 T11 |
| Lifetime @ Temp.: | 1500 Hrs @ 65°C |
| Lead Spacing: | 0.748" (19.00mm) |
| Height - Seated (Max): | 2.421" (61.50mm) |
| Expanded Description: | 350F (EDLC) Supercapacitor 2.7V Radial, Can 3.2 mOhm 1500 Hrs @ 65°C |
| ESR (Equivalent Series Resistance): | 3.2 mOhm |
| Description: | CAP 350F 2.7V THROUGH HOLE |
| Capacitance: | 350F |
| Email: | [email protected] |
Related parts for BCAP0350 E270 T11
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers