BYCHIPS is the stocking distributor for BB804SF1E6327HTSA1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BB804SF1E6327HTSA1 by email, we will give you a best price according your plan.
Buy BB804SF1E6327HTSA1 with BYCHPS
Buy with guarantee
BB804SF1E6327HTSA1
- Part Number:
- BB804SF1E6327HTSA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- DIODE VAR CAP 18V 50MA SOT-23
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18489 Pieces
- Data sheet:
- BB804SF1E6327HTSA1.pdf
Introduction
Specifications
| Voltage - Peak Reverse (Max): | 18V |
|---|---|
| Supplier Device Package: | PG-SOT23-3 |
| Series: | - |
| Q @ Vr, F: | 200 @ 2V, 100 MHz |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | TO-236-3, SC-59, SOT-23-3 |
| Other Names: | BB 804 SF1 E6327 BB 804 SF1 E6327-ND BB804SF1E6327BTSA1 BB804SF1E6327XT SP000010425 |
| Operating Temperature: | -55°C ~ 125°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | BB804SF1E6327HTSA1 |
| Expanded Description: | Varactor 1 Pair Common Cathode 18V Surface Mount PG-SOT23-3 |
| Diode Type: | 1 Pair Common Cathode |
| Description: | DIODE VAR CAP 18V 50MA SOT-23 |
| Capacitance Ratio Condition: | C2/C8 |
| Capacitance Ratio: | 1.71 |
| Capacitance @ Vr, F: | 47.5pF @ 2V, 1MHz |
| Email: | [email protected] |
Related parts for BB804SF1E6327HTSA1
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
ZMV835ATC | Diodes Incorporated | DIODE VARACTOR 25V SOD323 | Inquiry |
 |
BB814E6327GR2HTSA1 | Infineon Technologies | DIODE VAR CAP 18V 50MA SOT-23 | Inquiry |
 |
BBY5305WE6327HTSA1 | Infineon Technologies | DIODE TUNING HIGH Q CC SOT-323 | Inquiry |
|
BB804SF2E6327HTSA1 | Infineon Technologies | DIODE VAR CAP 18V 50MA SOT-23 | Inquiry |
 |
SVC383T-TL-E | ON Semiconductor | DIODE VARACTOR 33V CPH3 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers