BYCHIPS is the stocking distributor for BB535E7904HTSA1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BB535E7904HTSA1 by email, we will give you a best price according your plan.
Buy BB535E7904HTSA1 with BYCHPS
Buy with guarantee
BB535E7904HTSA1
- Part Number:
- BB535E7904HTSA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- DIODE VAR CAP 30V 20MA SOD-323
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19050 Pieces
- Data sheet:
- BB535E7904HTSA1.pdf
Introduction
Specifications
| Voltage - Peak Reverse (Max): | 30V |
|---|---|
| Supplier Device Package: | PG-SOD323-2 |
| Series: | - |
| Q @ Vr, F: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | SC-76, SOD-323 |
| Other Names: | BB 535 E7904 BB 535 E7904-ND BB535E7904 BB535E7904HTSA1TR BB535E7904INTR BB535E7904INTR-ND BB535E7904XT SP000010375 |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | BB535E7904HTSA1 |
| Expanded Description: | Varactor Single 30V Surface Mount PG-SOD323-2 |
| Diode Type: | Single |
| Description: | DIODE VAR CAP 30V 20MA SOD-323 |
| Capacitance Ratio Condition: | C1/C28 |
| Capacitance Ratio: | 9.8 |
| Capacitance @ Vr, F: | 2.3pF @ 28V, 1MHz |
| Email: | [email protected] |
Related parts for BB535E7904HTSA1
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
BB535E7908HTSA1 | Infineon Technologies | DIODE VARACTOR 30V SOD-323 | Inquiry |
 |
ZMV933TA | Diodes Incorporated | DIODE VAR CAP 42PF 12V SOD-323 | Inquiry |
 |
1SV282TPH3F | Toshiba Semiconductor and Storage | DIODE VARACTOR 34V SINGLE ESC | Inquiry |
 |
FMMV2103TA | Diodes Incorporated | DIODE VAR CAPAC 30V 10PF SOT23-3 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers