BYCHIPS is the stocking distributor for BB182,315, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BB182,315 by email, we will give you a best price according your plan.
Buy BB182,315 with BYCHPS
Buy with guarantee
BB182,315
- Part Number:
- BB182,315
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- DIODE VHF VAR CAP 32V SOD523
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15089 Pieces
- Data sheet:
- 1.BB182,315.pdf2.BB182,315.pdf
Introduction
Specifications
| Voltage - Peak Reverse (Max): | 32V |
|---|---|
| Supplier Device Package: | SOD-523 |
| Series: | - |
| Q @ Vr, F: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | SC-79, SOD-523 |
| Other Names: | 934047500315 |
| Operating Temperature: | -55°C ~ 125°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | BB182,315 |
| Expanded Description: | Varactor Single 32V Surface Mount SOD-523 |
| Diode Type: | Single |
| Description: | DIODE VHF VAR CAP 32V SOD523 |
| Capacitance Ratio Condition: | C1/C28 |
| Capacitance Ratio: | 22 |
| Capacitance @ Vr, F: | 2.89pF @ 28V, 1MHz |
| Email: | [email protected] |
Related parts for BB182,315
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
SVC203C-TB-E | ON Semiconductor | DIODE FM VARICAP TWIN VR 8V CP | Inquiry |
 |
BB182,115 | NXP USA Inc. | DIODE VHF VAR CAP 32V SOD523 | Inquiry |
 |
BB664H7902XTSA1 | Infineon Technologies | DIODE VAR CAP 30V 20MA SCD80 | Inquiry |
|
BB182,135 | NXP USA Inc. | DIODE VHF VAR CAP 32V SOD523 | Inquiry |
 |
BB182LX,315 | NXP USA Inc. | DIODE VHF VAR CAP 32V SOD882 | Inquiry |
|
BB182,335 | NXP USA Inc. | DIODE VHF VAR CAP 32V SOD523 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers