BYCHIPS is the stocking distributor for BB149,115, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BB149,115 by email, we will give you a best price according your plan.
Buy BB149,115 with BYCHPS
Buy with guarantee
BB149,115
- Part Number:
- BB149,115
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- DIODE UHF VAR CAP 30V SOD323
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13802 Pieces
- Data sheet:
- BB149,115.pdf
Introduction
Specifications
| Voltage - Peak Reverse (Max): | 30V |
|---|---|
| Supplier Device Package: | SOD-323 |
| Series: | - |
| Q @ Vr, F: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | SC-76, SOD-323 |
| Other Names: | 568-6038-2 934033290115 BB149 T/R BB149 T/R-ND BB149,115-ND |
| Operating Temperature: | -55°C ~ 125°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | BB149,115 |
| Expanded Description: | Varactor Single 30V Surface Mount SOD-323 |
| Diode Type: | Single |
| Description: | DIODE UHF VAR CAP 30V SOD323 |
| Capacitance Ratio Condition: | C1/C28 |
| Capacitance Ratio: | 10 |
| Capacitance @ Vr, F: | 2.25pF @ 28V, 1MHz |
| Email: | [email protected] |
Related parts for BB149,115
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
BB149A,115 | NXP USA Inc. | DIODE UHF VAR CAP 30V SOD323 | Inquiry |
|
BB149A,135 | NXP USA Inc. | DIODE UHF VAR CAP 30V SOD323 | Inquiry |
 |
MA2SV0300L | Panasonic Electronic Components | DIODE VARIABLE CAP 6V SSMINI-2P | Inquiry |
 |
BB804SF2E6327HTSA1 | Infineon Technologies | DIODE VAR CAP 18V 50MA SOT-23 | Inquiry |
|
BB149,135 | NXP USA Inc. | DIODE UHF VAR CAP 30V SOD323 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers