BYCHIPS is the stocking distributor for BA885E6327HTSA1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BA885E6327HTSA1 by email, we will give you a best price according your plan.
Buy BA885E6327HTSA1 with BYCHPS
Buy with guarantee
BA885E6327HTSA1
- Part Number:
- BA885E6327HTSA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- DIODE RF SW 50V 50MA SOT-23
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14566 Pieces
- Data sheet:
- BA885E6327HTSA1.pdf
Introduction
Specifications
| Voltage - Peak Reverse (Max): | 50V |
|---|---|
| Supplier Device Package: | PG-SOT23-3 |
| Series: | - |
| Resistance @ If, F: | 7 Ohm @ 10mA, 100MHz |
| Power Dissipation (Max): | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | TO-236-3, SC-59, SOT-23-3 |
| Other Names: | BA 885 E6327 BA 885 E6327-ND BA885E6327BTSA1 BA885E6327XT SP000010151 |
| Operating Temperature: | 150°C (TJ) |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Manufacturer Part Number: | BA885E6327HTSA1 |
| Expanded Description: | RF Diode PIN - Single 50V 50mA PG-SOT23-3 |
| Diode Type: | PIN - Single |
| Description: | DIODE RF SW 50V 50MA SOT-23 |
| Current - Max: | 50mA |
| Capacitance @ Vr, F: | 0.6pF @ 10V, 1MHz |
| Email: | [email protected] |
Related parts for BA885E6327HTSA1
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
MA4P604-131 | M/A-Com Technology Solutions | DIODE PIN CHIP CERAMIC SI | Inquiry |
 |
HSMS-270C-BLKG | Broadcom Limited | DIODE SCHOTTKY 15V 750MA SOT-323 | Inquiry |
 |
BAT1504WH6327XTSA1 | Infineon Technologies | DIODE SCHOTTKY 4V 110MA SOT323 | Inquiry |
 |
APD0510-000 | Skyworks Solutions Inc. | DIODE SILICON PIN 50V CHIP | Inquiry |
 |
HSMS-286L-TR1G | Broadcom Limited | DIODE SCHOTTKY DETECT HF SOT-363 | Inquiry |
 |
MADP-030015-13140G | M/A-Com Technology Solutions | DIODE PIN HMIC SURMOUNT | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers