BYCHIPS is the stocking distributor for B88069X9800B502, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for B88069X9800B502 by email, we will give you a best price according your plan.
Buy B88069X9800B502 with BYCHPS
Buy with guarantee
B88069X9800B502
- Part Number:
- B88069X9800B502
- Manufacturer:
- EPCOS
- Description:
- GDT 230V 20% 10KA THROUGH HOLE
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15020 Pieces
- Data sheet:
- B88069X9800B502.pdf
Introduction
Specifications
| Voltage - DC Spark Over (Nom): | 230V |
|---|---|
| Tolerance: | ±20% |
| Series: | T33-A230X |
| Packaging: | Bulk |
| Package / Case: | Axial Cylinder, 3 Lead (Radial Bend) |
| Other Names: | 495-5895 B88069X9800B502-ND T33-A230X T33A230X |
| Number of Poles: | 3 |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 14 Weeks |
| Manufacturer Part Number: | B88069X9800B502 |
| Impulse Discharge Current (8/20µs): | 10000A (10kA) |
| Fail Short: | No |
| Expanded Description: | Gas Discharge Tube 10000A (10kA) ±20% 3 Pole Through Hole |
| Description: | GDT 230V 20% 10KA THROUGH HOLE |
| Email: | [email protected] |
Related parts for B88069X9800B502
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers