BYCHIPS is the stocking distributor for B82724J2182N20, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for B82724J2182N20 by email, we will give you a best price according your plan.
Buy B82724J2182N20 with BYCHPS
Buy with guarantee
B82724J2182N20
- Part Number:
- B82724J2182N20
- Manufacturer:
- EPCOS
- Description:
- DOUBLE CHOKE 22MH 1.8A VERT
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12159 Pieces
- Data sheet:
- B82724J2182N20.pdf
Introduction
Specifications
| Series: | B82724 |
|---|---|
| Other Names: | B82724J2182N 20 B82724J2182N020 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | B82724J2182N20 |
| Expanded Description: | Line Common Mode Choke DCR |
| Description: | DOUBLE CHOKE 22MH 1.8A VERT |
| Email: | [email protected] |
Related parts for B82724J2182N20
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
B82724J2103U040 | EPCOS (TDK) | CMC 500UH 10A 2LN | Inquiry |
|
B82724J2162N1 | EPCOS (TDK) | CMC 10MH 1.6A 2LN TH | Inquiry |
|
B82724J2222N21 | EPCOS (TDK) | CMC 20MH 2.2A 2LN TH | Inquiry |
|
B82724J2102N21 | EPCOS (TDK) | COMMON MODE CHOKE 39MH 1A 2LN TH | Inquiry |
|
B82724J2602N020 | EPCOS (TDK) | CMC 1.8MH 6A 2LN | Inquiry |
|
B82724J2182N21 | EPCOS (TDK) | CMC 33MH 1.8A 2LN TH | Inquiry |
|
B82724J2801N002 | EPCOS (TDK) | CMC 49MH 800MA 2LN | Inquiry |
 |
B82724J2142N1 | EPCOS (TDK) | CMC 27MH 1.4A 2LN TH | Inquiry |
 |
B82724J2102N1 | EPCOS (TDK) | COMMON MODE CHOKE 33MH 1A 2LN TH | Inquiry |
|
B82724J2142N21 | EPCOS (TDK) | CMC 37MH 1.4A 2LN TH | Inquiry |
|
B82724J2602N1 | EPCOS (TDK) | COMMON MODE CHOKE 1MH 6A 2LN TH | Inquiry |
|
B82724J2222N20 | EPCOS (TDK) | CMC 15MH 2.2A 2LN TH | Inquiry |
|
B82724J2332N1 | EPCOS (TDK) | CMC 5.6MH 3.3A 2LN TH | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers