BYCHIPS is the stocking distributor for B1325-2R5106, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for B1325-2R5106 by email, we will give you a best price according your plan.
Buy B1325-2R5106 with BYCHPS
Buy with guarantee
B1325-2R5106
- Part Number:
- B1325-2R5106
- Manufacturer:
- Bussmann (Eaton)
- Description:
- CAP 10F -20% +80% 2.5V T/H
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15033 Pieces
- Data sheet:
- B1325-2R5106.pdf
Introduction
Specifications
| Voltage - Rated: | 2.5V |
|---|---|
| Tolerance: | -20%, +80% |
| Termination: | Through Hole |
| Size / Dimension: | 0.531" Dia (13.50mm) |
| Series: | PowerStor B |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Other Names: | 283-2508 526-2508 526-2508-ND |
| Operating Temperature: | -25°C ~ 70°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | B1325-2R5106 |
| Lifetime @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | 0.197" (5.00mm) |
| Height - Seated (Max): | 1.118" (28.40mm) |
| Expanded Description: | 10F -20%, +80%(EDLC) Supercapacitor 2.5V Radial, Can 60 mOhm @ 1kHz 1000 Hrs @ 70°C |
| ESR (Equivalent Series Resistance): | 60 mOhm @ 1kHz |
| Description: | CAP 10F -20% +80% 2.5V T/H |
| Capacitance: | 10F |
| Email: | [email protected] |
Related parts for B1325-2R5106
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
B1325-2R5106-R | Eaton | CAP 10F -20% +80% 2.5V T/H | Inquiry |
 |
PAS1020LA2R3475 | Taiyo Yuden | CAP 4.7F 20% 2.3V THROUGH HOLE | Inquiry |
 |
MAL219691201E3 | Vishay BC Components | CAP ALUM 15F 1.4V SNAP | Inquiry |
 |
B48621A7334Q018 | EPCOS (TDK) | CAP 33F -10% +30% 42V CHAS MNT | Inquiry |
 |
DVS-3R6D224T-R5 | Elna America | CAP 220MF 3.6V SURFACE MOUNT | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers