BYCHIPS is the stocking distributor for AT80251G2D-3CSUM, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for AT80251G2D-3CSUM by email, we will give you a best price according your plan.
Buy AT80251G2D-3CSUM with BYCHPS
Buy with guarantee
AT80251G2D-3CSUM
- Part Number:
- AT80251G2D-3CSUM
- Manufacturer:
- Micrel / Microchip Technology
- Description:
- IC MCU 8BIT ROMLESS 40PDIL
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18230 Pieces
- Data sheet:
- AT80251G2D-3CSUM.pdf
Introduction
Specifications
| Voltage - Supply (Vcc/Vdd): | 4.5 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | 40-PDIL |
| Speed: | 24MHz |
| Series: | 8x251 |
| RAM Size: | 1K x 8 |
| Program Memory Type: | ROMless |
| Program Memory Size: | - |
| Peripherals: | POR, PWM, WDT |
| Packaging: | Tube |
| Package / Case: | 40-DIP (0.600", 15.24mm) |
| Oscillator Type: | Internal |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Number of I/O: | 32 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | AT80251G2D-3CSUM |
| Expanded Description: | C251 8x251 Microcontroller IC 8/16-Bit 24MHz ROMless 40-PDIL |
| EEPROM Size: | - |
| Description: | IC MCU 8BIT ROMLESS 40PDIL |
| Data Converters: | - |
| Core Size: | 8/16-Bit |
| Core Processor: | C251 |
| Connectivity: | EBI/EMI, I²C, Microwire, SPI, UART/USART |
| Email: | [email protected] |
Related parts for AT80251G2D-3CSUM
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
AT80251G2D-SLSUL | Microchip Technology | IC MCU 8BIT ROMLESS 44PLCC | Inquiry |
|
AT80251G2D-SLSUM | Microchip Technology | IC MCU 8BIT ROMLESS 44PLCC | Inquiry |
 |
AT80251G2D-RLTUM | Microchip Technology | IC MCU 8BIT ROMLESS 44VQFP | Inquiry |
|
AT80251G2D-SLRUM | Microchip Technology | IC MCU 8BIT ROMLESS 44PLCC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers