BYCHIPS is the stocking distributor for AT25XV021A-XMHV-T, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for AT25XV021A-XMHV-T by email, we will give you a best price according your plan.
Buy AT25XV021A-XMHV-T with BYCHPS
Buy with guarantee
AT25XV021A-XMHV-T
- Part Number:
- AT25XV021A-XMHV-T
- Manufacturer:
- Adesto Technologies
- Description:
- IC FLASH 2MBIT 70MHZ 8TSSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17460 Pieces
- Data sheet:
- AT25XV021A-XMHV-T.pdf
Introduction
Specifications
| Voltage - Supply: | 1.65 V ~ 4.4 V |
|---|---|
| Supplier Device Package: | 8-TSSOP |
| Speed: | 70MHz |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 8-TSSOP (0.173", 4.40mm Width) |
| Other Names: | 1265-1190-2 |
| Operating Temperature: | -40°C ~ 85°C (TC) |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Memory Type: | Non-Volatile |
| Memory Size: | 2Mb (256K x 8) |
| Memory Format: | FLASH |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | AT25XV021A-XMHV-T |
| Interface: | SPI Serial |
| Description: | IC FLASH 2MBIT 70MHZ 8TSSOP |
| Email: | [email protected] |
Related parts for AT25XV021A-XMHV-T
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
AT25XV021A-MHV-Y | Adesto Technologies | IC FLASH 2MBIT 70MHZ 8UDFN | Inquiry |
 |
AT25XV021A-SSHV-T | Adesto Technologies | IC FLASH 2MBIT 70MHZ 8SOIC | Inquiry |
|
AT25XV021A-XMHV-B | Adesto Technologies | IC FLASH 2MBIT 70MHZ 8TSSOP | Inquiry |
|
AT25XV021A-SSHV-B | Adesto Technologies | IC FLASH 2MBIT 70MHZ 8SOIC | Inquiry |
|
AT25XV021A-MHV-T | Adesto Technologies | IC FLASH 2MBIT 70MHZ 8DFN | Inquiry |
|
AT25XV041B-SSHV-B | Adesto Technologies | IC FLASH 4MBIT 85MHZ 8SOIC | Inquiry |
 |
AT25XV021A-MAHV-T | Adesto Technologies | IC FLASH 2MBIT 70MHZ 8DFN | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers