BYCHIPS is the stocking distributor for AS8510-ASSP, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for AS8510-ASSP by email, we will give you a best price according your plan.
Buy AS8510-ASSP with BYCHPS
Buy with guarantee
AS8510-ASSP
- Part Number:
- AS8510-ASSP
- Manufacturer:
- ams
- Description:
- IC BATTERY MANAGEMENT 20-SSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17300 Pieces
- Data sheet:
- AS8510-ASSP.pdf
Introduction
Specifications
| Type: | Battery Management |
|---|---|
| Supplier Device Package: | 20-SSOP |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 20-SSOP (0.209", 5.30mm Width) |
| Output Type: | Analog, Digital |
| Other Names: | 183200016 183200024 AS8510-ASST AS8510-ASST-ND |
| Operating Temperature: | -40°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | AS8510-ASSP |
| Interface: | SPI |
| Input Type: | Analog, Digital |
| Description: | IC BATTERY MANAGEMENT 20-SSOP |
| Current - Supply: | 5mA |
| Email: | [email protected] |
Related parts for AS8510-ASSP
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
XTR105P | Texas Instruments | IC 4-20MA I-TRANSMITTER 14-DIP | Inquiry |
 |
TDC-GP21 TRA | ams | ULTRASONIC FLOW SENSOR 32QFN | Inquiry |
 |
AS8515-ZMFP | ams | IC TXRX DAC LIN 32MLF | Inquiry |
|
AS8510-ASSM | ams | IC BATTERY MANAGEMENT 20-SSOP | Inquiry |
 |
MAX31850JATB+T | Maxim Integrated | IC CONV THRMCPLE-DIG J TYPE TDFN | Inquiry |
|
AS1716-ASOT | ams | IC AFE CAPACTIVE SENSOR 8-SOIC | Inquiry |
|
AS8515-ZMFM | ams | IC BATTERY MANAGEMENT | Inquiry |
 |
AD9845BJSTZ | Analog Devices Inc. | IC CCD SIGNAL PROC 12BIT 48-LQFP | Inquiry |
 |
AT42QT5480-CU | Microchip Technology | IC SENSOR DUAL TOUCH 49-BGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers